part number: XZDGK81FS 2.8x0.8mm right angle smd chip led lamp sep 28,2016 xdsb7808 v5-x layout: maggie l. p. 1/5 features ideal for indication light on hand held products long life and robust package standard package: 2,000pcs/ reel msl (moisture sensitivity level): 3 rohs compliant attention observe precautions for handling electrostatic discharge sensitive devices package schematics notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.1(0.0039") unless otherwise noted. 3. specifications are subjec t to change without notice. absolute maximum ratings (t a =25c) green (ingan) unit reverse voltage v r 5 v forward current i f 25 ma forward current (peak) 1/10 duty cycle 0.1ms pulse width i fs 150 ma power dissipation p d 102.5 mw 450 v operating temperature t a -40 ~ +85 c storage temperature tstg -40 ~ +85 electrostatic discharge threshold (hbm) green (ingan) unit forward voltage (typ.) (i f =20ma) v f 3.3 v forward voltage (max.) (i f =20ma) v f 4.1 v reverse current (max.) (v r =5v) i r 50 ua wavelength of peak emission cie127-2007*(typ.) (i f =20ma) p 515* nm wavelength of dominant emissioncie127-2007*(typ.) (i f =20ma) d 525* nm spectral line full width at half-maximum (typ.) (i f =20ma) 35 nm capacitance (typ.) (v f =0v, f=1mhz) c 45 pf operating characteristics (t a =25c) part number emitting color emitting material lens-color wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. XZDGK81FS green ingan water clear 500 500* 795 795* 515* 110 luminous intensity cie127-2007* (i f =20ma) mcd *luminous intensity value and wavelength are in accordance with cie127-2007 standards. a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/jesd625-a and jedec/j-std-033)
part number: XZDGK81FS 2.8x0.8mm right angle smd chip led lamp sep 28,2016 xdsb7808 v5-x layout: maggie l. p. 2/5 handling precautions compare to epoxy encapsulant that is ha rd and brittle, silicone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more susc eptible to damage by external mechanical force. as a result, special handling precautions need to be obse rved during assembly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1.do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 2. as silicone encapsulation is permeable to gases, some corrosive substances such as h 2 s might corrode silver plating of leadframe. special care should be taken if an led with si licone encapsulation is to be used near such substances.
part number: XZDGK81FS 2.8x0.8mm right angle smd chip led lamp sep 28,2016 xdsb7808 v5-x layout: maggie l. p. 3/5 ? green led is recommended for reflow soldering and soldering profile is shown below. green
part number: XZDGK81FS 2.8x0.8mm right angle smd chip led lamp sep 28,2016 xdsb7808 v5-x layout: maggie l. p. 4/5 ? the device has a single mounting surface. the device must be mounted according to the specifications. ? reel dimension ? recommended soldering pattern (units : mm; tolerance: 0.1) ? tape specification (units : mm) remarks: if special sorting is required (e.g. binn ing based on forward voltage, luminous intensity / luminous flux, or wavelength), the typical accuracy of the so rting process is as follows: 1. wavelength: +/-1nm 2. luminous intensity / luminous flux: +/-15% 3. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters.
part number: XZDGK81FS 2.8x0.8mm right angle smd chip led lamp sep 28,2016 xdsb7808 v5-x layout: maggie l. p. 5/5 packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp ?
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